The SM8975 hardware platform is undergoing certification in the Asian and US regions
Samsung Electronics has begun performance testing for the upcoming Galaxy S27 flagship smartphone series using an unreleased Qualcomm chipset. The developer is already conducting hardware verification as part of three separate regional projects. This was reported by Notebookcheck, according to the portal PromPolitInform.
According to data obtained from Qualcomm’s internal development portal, the project involves a chip with the codename SM8975. It is expected that upon official release, this product will be named Snapdragon 8 Elite Extreme Gen 6. The information confirms the creation of separate firmware versions for three regions: the Asia-Pacific area, South Korea, and the US carrier Verizon.
Technical Validation Process
Parallel development of regional builds indicates that the project has reached a stage preceding mass production. At this phase, Samsung usually completes initial silicon testing and begins fine-tuning radio frequency parameters and software tailored to specific carrier requirements.
The presence of a project entry linked to Verizon indicates the start of device certification for the United States market. All test builds utilize the developer’s internal designation Snapdragon_Premium_High_2026, which signifies that the platform belongs to the top-tier flagship chipset segment for next year.
Upcoming Presentation
The official unveiling of the Snapdragon 8 Elite Extreme Gen 6, alongside the standard Snapdragon 8 Elite Gen 6 model, is set to take place during the Snapdragon Summit. The event is scheduled for September 22–24 in Hawaii.
Historically, Samsung introduces its own Galaxy S series a few months after Qualcomm’s key hardware rollout. Traditionally, the device launch and retail availability occur in the first quarter of the following year.
Illustrative photo: 彭嘉傑 / CC BY 2.5
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